The TMS320DM8147BCYE1 is a digital signal processor from Texas Instruments, packaged in a 684-pin Flip Chip Ball Grid Array (FCBGA). It features a plastic package with a seated plane height of 3.06mm and a pin pitch of 0.8mm. The device is designed for surface mount applications and has a maximum package length and width of 23.1mm. It is part of the microcontrollers, microprocessors, and FPGAs category, specifically a digital signal processor.
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Texas Instruments TMS320DM8147BCYE1 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 684 |
| PCB | 684 |
| Package Length (mm) | 23.1(Max) |
| Package Width (mm) | 23.1(Max) |
| Package Height (mm) | 2.5 |
| Seated Plane Height (mm) | 3.06(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A002.a.1.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Texas Instruments TMS320DM8147BCYE1 to view detailed technical specifications.
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