100MHz, 32-bit fixed-point digital signal processor (DSP) with 100 MIPS performance. Features 128KB ROM and 320KB RAM. Surface mountable in a 196-pin NFBGA package (10x10x0.86mm) with 0.65mm pin pitch. Operates with supply voltages of 1.3V to 3.3V and a temperature range of 0°C to 70°C.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | NFBGA |
| Package Description | Plastic Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 196 |
| PCB | 196 |
| Package Length (mm) | 10 |
| Package Width (mm) | 10 |
| Package Height (mm) | 0.86 |
| Seated Plane Height (mm) | 1.3(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Data Bus Width | 32bit |
| Numeric and Arithmetic Format | Fixed-Point |
| Program Memory Type | ROM |
| Program Memory Size | 128KB |
| RAM Size | 320KB |
| Maximum Speed | 100MHz |
| Device Million Instructions per Second | 100MIPS |
| Device Input Clock Speed | 100MHz |
| Typical Operating Supply Voltage | 1.3|1.8|2.5|2.8|3.3V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Programmability | Yes |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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