Texas Instruments
TMX320DM355ZCE270
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA337, 13 X 13 MM, 0.65 MM PITCH, PLASTIC, BGA-337
Frequency270MHz
PackageLFBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TMX320DM355ZCE270 technical specifications.
General
Package/Case
LFBGA
Data Bus Width
16b
Frequency
270MHz
Interface
I2C, SPI, USB, UART
Max Frequency
270MHz
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Max Supply Voltage
3.465V
Memory Type
NAND, FLASH, SDRAM, DDR2
Min Supply Voltage
3.135V
Mount
Surface Mount
Number of Bits
32
Number of I/Os
104
Number of Programmable I/O
104
Package Quantity
1
Packaging
Tray
Radiation Hardening
No
RAM Size
32KB
Reach SVHC Compliant
No
RoHS Compliant
Yes
Series
TMS320DM3x, DaVinci™
Termination
SMD/SMT
Compliance
RoHS
Compliant
Datasheet
Texas Instruments TMX320DM355ZCE270 Datasheet
Download the complete datasheet for Texas Instruments TMX320DM355ZCE270 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.