PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TPA2011D1YFFR technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
DSBGA
Package Description
Die Size Ball Grid Array
Lead Shape
Ball
Pin Count
9
PCB
9
Package Length (mm)
1.6
Package Width (mm)
1.6
Package Height (mm)
0.43
Seated Plane Height (mm)
0.63(Max)
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Function
Speaker
Amplifier Type
Class-D
Typical PSRR
86dB
Input Signal Type
Differential
Output Signal Type
Differential
Output Type
1-Channel Mono
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TPA2011D1YFFR Datasheet
Download the complete datasheet for Texas Instruments TPA2011D1YFFR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.