This 28-pin Ball Grid Array IC is packaged in a DSBGA with a die size ball grid array configuration. It features a seated plane height of 0.63mm (max) and a pin pitch of 0.4mm. The package is made of plastic and is designed for surface mount applications.
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Texas Instruments TPD12S015YFFR technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | DSBGA |
| Package Description | Die Size Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 2.76 |
| Package Width (mm) | 1.56 |
| Package Height (mm) | 0.4 |
| Seated Plane Height (mm) | 0.63(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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