PackageDSBGA
MountingSurface Mount
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Technical Specifications
Texas Instruments TPS22924CYZPR technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
DSBGA
Package Description
Die Size Ball Grid Array
Lead Shape
Ball
Pin Count
6
PCB
6
Package Length (mm)
1.42(Max)
Package Width (mm)
0.92(Max)
Package Height (mm)
0.31(Max)
Seated Plane Height (mm)
0.5(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-211EA
Number of Outputs
1
Minimum Output Current
2(Max)A
Switch On Resistance
0.0227Ohm
Maximum Input Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Output Voltage Range
3.6(Max)V
Minimum Input Voltage
0.75V
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TPS22924CYZPR Datasheet
Download the complete datasheet for Texas Instruments TPS22924CYZPR to view detailed technical specifications.
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