The TPS65720YFFT is a 25-pin ball grid array power management multi-channel IC from Texas Instruments. It operates over a temperature range of -40°C to 85°C and accepts input voltages between 1.8V and 5.6V. This device is designed for surface mount applications and features a plastic package with a maximum seated plane height of 0.63mm. The TPS65720YFFT is a member of the PMIC category of power management ICs.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Texas Instruments TPS65720YFFT datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | DSBGA |
| Package Description | Die Size Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 25 |
| PCB | 25 |
| Package Length (mm) | 2.12(Max) |
| Package Width (mm) | 2.12(Max) |
| Package Height (mm) | 0.33(Max) |
| Seated Plane Height (mm) | 0.63(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Function | Power Management Multi-Channel IC |
| Input Voltage | 1.8 to 5.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Texas Instruments TPS65720YFFT to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
