PackageBGA MICROSTAR JUNIOR
MountingSurface Mount
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Technical Specifications
Texas Instruments TPS658600ZQZT technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA MICROSTAR JUNIOR
Lead Shape
Ball
Pin Count
120
PCB
120
Package Length (mm)
6.1(Max)
Package Width (mm)
6.1(Max)
Package Height (mm)
0.77(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Function
Power Management Unit
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
01295
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TPS658600ZQZT Datasheet
Download the complete datasheet for Texas Instruments TPS658600ZQZT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.