PackageBGA MICROSTAR JUNIOR
MountingSurface Mount
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Technical Specifications
Texas Instruments TPS658600ZQZT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA MICROSTAR JUNIOR |
| Lead Shape | Ball |
| Pin Count | 120 |
| PCB | 120 |
| Package Length (mm) | 6.1(Max) |
| Package Width (mm) | 6.1(Max) |
| Package Height (mm) | 0.77(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Function | Power Management Unit |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments TPS658600ZQZT Datasheet
Download the complete datasheet for Texas Instruments TPS658600ZQZT to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.