PackageDSBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Texas Instruments TSC2017IYZGR technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
DSBGA
Package Description
Die Size Ball Grid Array
Lead Shape
Ball
Pin Count
12
PCB
12
Package Length (mm)
2.3
Package Width (mm)
1.8
Package Height (mm)
0.38
Seated Plane Height (mm)
0.63(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Type
Resistive
Max Operating Supply Voltage
3.6V
Resolution
12bit
Interface Type
Serial (I2C)
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TSC2017IYZGR Datasheet
Download the complete datasheet for Texas Instruments TSC2017IYZGR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.