The TSS721AD is a 16-pin SOIC lead-frame SMT surface mount logic IC from Texas Instruments. It features a small outline IC package with a gull-wing lead shape and a maximum package length of 10mm. The IC is designed for surface mount applications and has a maximum seated plane height of 1.75mm. The package material is plastic and the pin pitch is 1.27mm. The TSS721AD is a Jedec MS-012AC compliant device.
Sign in to ask questions about the Texas Instruments TSS721AD datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Texas Instruments TSS721AD technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 10(Max) |
| Package Width (mm) | 4(Max) |
| Package Height (mm) | 1.5(Max) |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AC |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Texas Instruments TSS721AD to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
