PackageBGA MICROSTAR JUNIOR
MountingSurface Mount
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Technical Specifications
Texas Instruments TWL6040A3SRSZQZ technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA MICROSTAR JUNIOR
Lead Shape
Ball
Pin Count
120
PCB
120
Package Length (mm)
6.1(Max)
Package Width (mm)
6.1(Max)
Package Height (mm)
0.77(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
01295
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Texas Instruments TWL6040A3SRSZQZ Datasheet
Download the complete datasheet for Texas Instruments TWL6040A3SRSZQZ to view detailed technical specifications.
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