The TWL6040A3SRSZQZ is a surface mount power management IC packaged in a 120-pin BGA MICROSTAR JUNIOR. It has a maximum package length of 6.1mm, width of 6.1mm, and height of 0.77mm. The seated plane height is 1mm and the pin pitch is 0.5mm. The package material is plastic and it is designed for surface mount applications.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | BGA MICROSTAR JUNIOR |
| Lead Shape | Ball |
| Pin Count | 120 |
| PCB | 120 |
| Package Length (mm) | 6.1(Max) |
| Package Width (mm) | 6.1(Max) |
| Package Height (mm) | 0.77(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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