PackageUSC
MountingSurface Mount
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Technical Specifications
Toshiba 02DZ3.3-X(T3FJTN) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
USC
Package/Case
USC
Lead Shape
Gull-wing
Pin Count
2
PCB
2
Package Length (mm)
1.7
Package Width (mm)
1.25
Package Height (mm)
0.9
Seated Plane Height (mm)
0.9
Package Weight (g)
0.0045
Package Material
Plastic
Mounting
Surface Mount
Jedec
SOD-323
Type
Voltage Regulator
Configuration
Single
Nominal Zener Voltage
3.225V
Maximum Zener Impedance
130Ohm
Zener Voltage Tolerance
2.5%
Maximum Power Dissipation
200mW
Maximum Reverse Leakage Current
20uA
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8541100050
Schedule B
8541100050
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba 02DZ3.3-X(T3FJTN) Datasheet
Download the complete datasheet for Toshiba 02DZ3.3-X(T3FJTN) to view detailed technical specifications.
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