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Technical Specifications
Toshiba 1SV276(T3KMC1) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
USC
Package/Case
USC
Lead Shape
Gull-wing
Pin Count
2
PCB
2
Package Length (mm)
1.7
Package Width (mm)
1.25
Package Height (mm)
0.9
Seated Plane Height (mm)
0.9
Package Weight (g)
0.0045
Package Material
Plastic
Mounting
Surface Mount
Jedec
SOD-323
Type
VCO
Configuration
Single
Maximum Reverse Voltage
10(Min)V
Minimum Tuning Ratio
1.8
Tuning Ratio Test Condition
1V/4V
Minimum Diode Capacitance
15@1VpF
Applications Frequency Range
UHF
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Compliance
Cage Code
S0562
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba 1SV276(T3KMC1) Datasheet
Download the complete datasheet for Toshiba 1SV276(T3KMC1) to view detailed technical specifications.
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