PackagePW-Mold
MountingThrough Hole
Quick Jump:
Technical Specifications
Toshiba 2SC3074(HARD72F5T2 technical specifications.
General
Package Family Name
IPAK
Package/Case
PW-Mold
Pin Count
3
PCB
3
Tab
Tab
Package Length (mm)
6.8(Max)
Package Width (mm)
2.5(Max)
Package Height (mm)
5.5
Pin Pitch (mm)
2.3
Mounting
Through Hole
Type
NPN
Configuration
Single
Number of Elements per Chip
1
Maximum Collector Base Voltage
60V
Maximum Emitter Base Voltage
5V
Maximum Collector-Emitter Voltage
50V
Maximum DC Collector Current
5A
Maximum Power Dissipation
1000mW
Material
Si
Minimum DC Current Gain
30@3A@1V
Maximum Transition Frequency
120(Typ)MHz
Category
Bipolar Power
Max Operating Temperature
150°C
Compliance
Cage Code
S0562
HTS Code
8541290075
Schedule B
8541290080
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba 2SC3074(HARD72F5T2 Datasheet
Download the complete datasheet for Toshiba 2SC3074(HARD72F5T2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.