
NPN Bipolar Junction Transistor (BJT) for surface mount applications. Features an 800V collector-emitter voltage and 0.05A maximum DC collector current. Housed in a 3-pin TO-252AB (New PW-Mold) package with a tab. Maximum power dissipation is 1000mW. Operates within a temperature range of -55°C to 150°C.
Toshiba 2SC6127 technical specifications.
| Package/Case | New PW-Mold |
| Pin Count | 3 |
| PCB | 2 |
| Tab | Tab |
| Package Length (mm) | 6.5 |
| Package Width (mm) | 5.5 |
| Package Height (mm) | 2.3 |
| Seated Plane Height (mm) | 2.4 |
| Package Weight (g) | 0.36 |
| Mounting | Surface Mount |
| Jedec | TO-252AB |
| Type | NPN |
| Configuration | Single |
| Number of Elements per Chip | 1 |
| Maximum Collector Base Voltage | 800V |
| Maximum Emitter Base Voltage | 5V |
| Maximum Collector-Emitter Voltage | 800V |
| Maximum DC Collector Current | 0.05A |
| Maximum Power Dissipation | 1000mW |
| Material | Si |
| Minimum DC Current Gain | 15@7mA@5V |
| Maximum Transition Frequency | 15(Typ)MHz |
| Category | Bipolar Power |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8541290095 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Download the complete datasheet for Toshiba 2SC6127 to view detailed technical specifications.
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