N-channel enhancement mode power MOSFET with a maximum drain-source voltage of 500V and continuous drain current of 5A. Features a TO-220NIS package for through-hole mounting, offering a 3-pin configuration with a tab. Utilizes pi-MOS V process technology, boasting a low drain-source on-resistance of 1500 mOhm at 10V and a typical gate charge of 17nC at 10V. Maximum power dissipation is 35W, with an operating temperature range of -55°C to 150°C.
PackageTO-220NIS
MountingThrough Hole
Quick Jump:
Technical Specifications
Toshiba 2SK2662(LBS2IKE-M2 technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | TO-220 |
| Package/Case | TO-220NIS |
| Package Description | Transistor Outline Package |
| Lead Shape | Through Hole |
| Pin Count | 3 |
| PCB | 3 |
| Tab | Tab |
| Package Length (mm) | 10 |
| Package Width (mm) | 4.5 |
| Package Height (mm) | 15 |
| Seated Plane Height (mm) | 15 + 5.6(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Configuration | Single |
| Category | Power MOSFET |
| Channel Mode | Enhancement |
| Channel Type | N |
| Number of Elements per Chip | 1 |
| Process Technology | pi-MOS V |
| Maximum Drain Source Voltage | 500V |
| Maximum Gate Source Voltage | ±30V |
| Maximum Continuous Drain Current | 5A |
| Material | Si |
| Maximum Gate Threshold Voltage | 4V |
| Maximum Drain Source Resistance | 1500@10VmOhm |
| Typical Gate Charge @ Vgs | 17@10VnC |
| Typical Gate Charge @ 10V | 17nC |
| Typical Input Capacitance @ Vds | 780@10VpF |
| Maximum Power Dissipation | 35000mW |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | S0562 |
| HTS Code | 8541290095 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba 2SK2662(LBS2IKE-M2 Datasheet
Download the complete datasheet for Toshiba 2SK2662(LBS2IKE-M2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.