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Technical Specifications
Toshiba 2SK3075(TE12L) technical specifications.
General
| Package/Case | PW-X |
| Pin Count | 3 |
| PCB | 3 |
| Package Length (mm) | 4.7 |
| Package Width (mm) | 4.5 |
| Package Height (mm) | 1.5 |
| Seated Plane Height (mm) | 1.5 |
| Mounting | Surface Mount |
| Channel Type | N |
| Configuration | Single |
| Number of Elements per Chip | 1 |
| Maximum Drain Source Voltage | 30V |
| Maximum Continuous Drain Current | 5A |
| Maximum Power Dissipation | 20000mW |
| Min Operating Temperature | -45°C |
| Max Operating Temperature | 150°C |
| Typical Power Gain | 11.7(Min)dB |
| Output Power | 7.5(Min)W |
Compliance
| Cage Code | S0562 |
| EU RoHS | No |
| HTS Code | 8541290095 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Toshiba 2SK3075(TE12L) Datasheet
Download the complete datasheet for Toshiba 2SK3075(TE12L) to view detailed technical specifications.
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