Dual N-channel/P-channel enhancement mode MOSFET, surface mount, SOT-363 package. Features 20V drain-source voltage, 0.05A continuous drain current, and 6 pins. Operates from -55°C to 150°C with a maximum power dissipation of 200mW. Package dimensions are 2mm x 1.25mm x 0.9mm.
PackageUS
MountingSurface Mount
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Technical Specifications
Toshiba HN1L02FU(T5RSONY,F technical specifications.
General
| Package/Case | US |
| Pin Count | 6 |
| PCB | 6 |
| Package Length (mm) | 2 |
| Package Width (mm) | 1.25 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.1(Max) |
| Package Weight (g) | 0.0068 |
| Mounting | Surface Mount |
| Jedec | SOT-363 |
| Configuration | Dual |
| Category | Small Signal |
| Channel Mode | Enhancement |
| Channel Type | N|P |
| Number of Elements per Chip | 2 |
| Maximum Drain Source Voltage | 20V |
| Maximum Gate Source Voltage | 10@N Channel|-7@P ChannelV |
| Maximum Continuous Drain Current | 0.05A |
| Material | Si |
| Maximum Drain Source Resistance | [email protected]mOhm |
| Typical Input Capacitance @ Vds | 5.5@3VpF |
| Maximum Power Dissipation | 200mW |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8541210095 |
| Schedule B | 8541210080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Toshiba HN1L02FU(T5RSONY,F Datasheet
Download the complete datasheet for Toshiba HN1L02FU(T5RSONY,F to view detailed technical specifications.
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