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Technical Specifications
Toshiba HN3G01J(T5RMATUTU1 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SSOP
Package/Case
SMV
Package Description
Small Outline Transistor
Lead Shape
Gull-wing
Pin Count
5
PCB
5
Package Length (mm)
2.9
Package Width (mm)
1.6
Package Height (mm)
1.1
Seated Plane Height (mm)
1.15
Pin Pitch (mm)
0.95
Package Weight (g)
0.014
Package Material
Plastic
Mounting
Surface Mount
Jedec
SOT-25
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Compliance
Cage Code
S0562
EU RoHS
No
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba HN3G01J(T5RMATUTU1 Datasheet
Download the complete datasheet for Toshiba HN3G01J(T5RMATUTU1 to view detailed technical specifications.
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