PackageSSM
MountingSurface Mount
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Technical Specifications
Toshiba JDH3D01S(TE85L,F) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SSM
Package/Case
SSM
Lead Shape
Gull-wing
Pin Count
3
PCB
3
Package Length (mm)
1.6
Package Width (mm)
0.8
Package Height (mm)
0.7
Seated Plane Height (mm)
0.9(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
SOT-416
Type
Schottky Diode
Configuration
Single
Maximum Continuous Forward Current
0.025A
Peak Forward Voltage
0.25(Typ)@0.002AV
Peak Reverse Current
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Operating Junction Temperature
125°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8541100070
Schedule B
8541100070
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba JDH3D01S(TE85L,F) Datasheet
Download the complete datasheet for Toshiba JDH3D01S(TE85L,F) to view detailed technical specifications.
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