
Dual N/P-channel enhancement mode silicon MOSFET, surface mountable in a 6-pin US (SOT-363) package. Features a maximum drain-source voltage of 30V and a maximum continuous drain current of 0.4A for the N-channel and 0.2A for the P-channel. Operating temperature range is -55°C to 150°C, with a maximum power dissipation of 300mW. Package dimensions are 2mm x 1.25mm x 0.9mm.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Toshiba SSM6L09FU(TE85L,F) datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Package/Case | US |
| Pin Count | 6 |
| PCB | 6 |
| Package Length (mm) | 2 |
| Package Width (mm) | 1.25 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.1(Max) |
| Package Weight (g) | 0.0068 |
| Mounting | Surface Mount |
| Jedec | SOT-363 |
| Configuration | Dual |
| Category | Small Signal |
| Channel Mode | Enhancement |
| Channel Type | N|P |
| Number of Elements per Chip | 2 |
| Maximum Drain Source Voltage | 30V |
| Maximum Gate Source Voltage | ±20V |
| Maximum Continuous Drain Current | 0.4@N Channel|0.2@P ChannelA |
| Material | Si |
| Maximum Drain Source Resistance | 700@10V@N Channel|2700@10V@P ChannelmOhm |
| Typical Input Capacitance @ Vds | 20@5V@N Channel|22@5V@P ChannelpF |
| Maximum Power Dissipation | 300mW |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 150°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8541210095 |
| Schedule B | 8541210080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Toshiba SSM6L09FU(TE85L,F) to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.