24-Pin SSOP Modulator for RF applications. This lead-frame SMT component features a gull-wing lead shape and a compact 8.3mm x 5.6mm x 1.2mm plastic package with a 0.65mm pin pitch. Operating across a wide temperature range of -20°C to 75°C, it supports supply voltages from 4.5V to 35V. Maximum power dissipation is 850mW with a maximum supply current of 66A.
PackageSSOP
MountingSurface Mount
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Technical Specifications
Toshiba TA1297AFN(F,EL,ALP technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
8.3(Max)
Package Width (mm)
5.6
Package Height (mm)
1.2
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.65
Package Weight (g)
0.14
Package Material
Plastic
Mounting
Surface Mount
Device Type
Modulator
Min Operating Temperature
-20°C
Max Operating Temperature
75°C
Programmability
No
Min Operating Supply Voltage
4.5|27V
Typical Operating Supply Voltage
5|33V
Max Operating Supply Voltage
5.5|35V
Maximum Power Dissipation
850mW
Maximum Supply Current
66A
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TA1297AFN(F,EL,ALP Datasheet
Download the complete datasheet for Toshiba TA1297AFN(F,EL,ALP to view detailed technical specifications.
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