The TA7358P(N) is a 9-pin SIP through hole RF front end IC from Toshiba. It features a single in line package with a seated plane height of 7.9mm and a pin pitch of 2.54mm. The IC is designed for through hole mounting and has a plastic package material. The operating temperature range is not specified in the provided data.
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| Basic Package Type | Through Hole |
| Package Family Name | SIP |
| Package/Case | SIP |
| Package Description | Single In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 9 |
| PCB | 9 |
| Package Length (mm) | 22.78(Max) |
| Package Width (mm) | 3.2 |
| Package Height (mm) | 5.6 |
| Seated Plane Height (mm) | 7.9(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Cage Code | S0562 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Download the complete datasheet for Toshiba TA7358P(N) to view detailed technical specifications.
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