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Technical Specifications
Toshiba TA8083F(I,EL) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
HSOP
Package/Case
HSOP
Package Description
Heat Sinked Small Outline Package
Lead Shape
Gull-wing
Pin Count
22
PCB
20
Tab
2Tab
Package Length (mm)
16.5(Max)
Package Width (mm)
8.8
Package Height (mm)
2.3
Seated Plane Height (mm)
2.7(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Type
Motor Driver
Min Operating Supply Voltage
8V
Max Operating Supply Voltage
16V
Maximum Operating Current
60mA
Min Operating Temperature
-40°C
Max Operating Temperature
110°C
Compliance
Cage Code
S0562
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TA8083F(I,EL) Datasheet
Download the complete datasheet for Toshiba TA8083F(I,EL) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.