The Toshiba TA8132AFG(M) is a surface mount RF & wireless IC packaged in a 24-pin SSOP lead-frame SMT package. It has a package length of 13.5mm maximum, a width of 6mm, and a height of 1.8mm. The seated plane height is 2.2mm maximum, with a pin pitch of 1mm. The package is made of plastic and is designed for surface mount applications.
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Toshiba TA8132AFG(M) technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 13.5(Max) |
| Package Width (mm) | 6 |
| Package Height (mm) | 1.8 |
| Seated Plane Height (mm) | 2.2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | S0562 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
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