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Technical Specifications
Toshiba TA8819FG(EL) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 30 |
| PCB | 30 |
| Package Length (mm) | 15.9(Max) |
| Package Width (mm) | 7.5 |
| Package Height (mm) | 2.3 |
| Seated Plane Height (mm) | 2.7(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| CPU Interface | No |
| DRAM Interface | No |
| Min Operating Supply Voltage | 3.3V |
| Typical Operating Supply Voltage | 5V |
| Max Operating Supply Voltage | 7.5V |
| Maximum Power Dissipation | 890mW |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 75°C |
| Operating Supply Voltage | 5V |
Compliance
| Cage Code | S0562 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TA8819FG(EL) Datasheet
Download the complete datasheet for Toshiba TA8819FG(EL) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.