PackageHTSSOP EP
MountingSurface Mount
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Technical Specifications
Toshiba TB62210FNG technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
HTSSOP EP
Package Description
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
7.8
Package Width (mm)
4.4
Package Height (mm)
0.9
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Weight (g)
0.1
Package Material
Plastic
Mounting
Surface Mount
Type
Stepper Motor Driver
Output Voltage
40(Max)V
Min Operating Supply Voltage
4.75V
Typical Operating Supply Voltage
5V
Max Operating Supply Voltage
5.25V
Min Operating Temperature
-20°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TB62210FNG Datasheet
Download the complete datasheet for Toshiba TB62210FNG to view detailed technical specifications.
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