Sign in to ask questions about the Toshiba TB62214AFNG datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Toshiba TB62214AFNG technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | HTSSOP EP |
| Package Description | Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
| Lead Shape | Gull-wing |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 12.5 |
| Package Width (mm) | 6.1 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153EDT |
| Type | Motor Driver |
| Output Voltage | 40(Max)V |
| Min Operating Supply Voltage | 4.75V |
| Typical Operating Supply Voltage | 5V |
| Max Operating Supply Voltage | 5.25V |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Toshiba TB62214AFNG to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
