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Toshiba TB62726AFG(EL,S,M) technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 13 |
| Package Width (mm) | 6 |
| Package Height (mm) | 1.5 |
| Package Weight (g) | 0.29 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| High Level Output Current | -1000uA |
| Low Level Output Current | 1000uA |
| Output Voltage | 4(Max)V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Max Operating Supply Voltage | 5.5V |
| Maximum Power Dissipation | 1000mW |
| Maximum Supply Current | 40000uA |
| Min Operating Supply Voltage | 3V |
| Typical Operating Supply Voltage | 3.3|5V |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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