4-bit binary full adder integrated circuit, CMOS logic family, featuring a single element per chip. This through-hole mounted component is housed in a 16-pin PDIP package with a 2.54mm pin pitch. It offers maximum output currents of -24mA (high) and 24mA (low), with a maximum power dissipation of 500mW. Operating temperature range is -40°C to 85°C.
PackagePDIP
MountingThrough Hole
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Technical Specifications
Toshiba TC74AC283P(F) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
16
PCB
16
Package Length (mm)
19.75(Max)
Package Width (mm)
6.4
Package Height (mm)
3.5
Seated Plane Height (mm)
4.15
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Jedec
MS-001BB
Logic Family
AC
Logic Function
Binary Full Adder
Process Technology
CMOS
Number of Elements per Chip
1
Number of Bits
4
Maximum High Level Output Current
-24mA
Maximum Low Level Output Current
24mA
Maximum Power Dissipation
500mW
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TC74AC283P(F) Datasheet
Download the complete datasheet for Toshiba TC74AC283P(F) to view detailed technical specifications.
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