Dual D-type positive-edge triggered flip-flop IC, CMOS logic family, featuring two independent elements. Surface mountable in a 14-pin SOL (Small Outline IC) package with gull-wing leads, measuring 8.65mm x 3.9mm x 1.38mm with a 1.27mm pin pitch. Operates across a temperature range of -40°C to 85°C.
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Toshiba TC74AC74FN(F,M) technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOL |
| Package Description | Small Outline IC (L Lead) |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 8.65 |
| Package Width (mm) | 3.9 |
| Package Height (mm) | 1.38 |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-012AB |
| Logic Family | AC |
| Logic Function | D-Type |
| Process Technology | CMOS |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 1 |
| Number of Element Outputs | 1 |
| Polarity | Inverting/Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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