PackagePDIP
MountingThrough Hole
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Technical Specifications
Toshiba TC74HC221AP(M) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
16
PCB
16
Package Length (mm)
19.75(Max)
Package Width (mm)
6.4
Package Height (mm)
3.5
Seated Plane Height (mm)
4.15
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Jedec
MS-001BB
Logic Family
HC
Logic Function
Monostable Multivibrator
Process Technology
CMOS
Number of Elements per Chip
2
Maximum High Level Output Current
-5.2mA
Maximum Low Level Output Current
5.2mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TC74HC221AP(M) Datasheet
Download the complete datasheet for Toshiba TC74HC221AP(M) to view detailed technical specifications.
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