
8-channel non-inverting 3-state CMOS buffer/line driver, featuring 8 inputs and 8 outputs. This integrated circuit utilizes HC logic family and CMOS process technology. Packaged in a 20-pin PDIP (Plastic Dual In Line Package) with through-hole mounting, it offers a pin pitch of 2.54mm and dimensions of 25.1mm (L) x 6.4mm (W) x 3.5mm (H). Operating temperature range is -40°C to 85°C.
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Toshiba TC74HC244AP(HQ) technical specifications.
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | PDIP |
| Package Description | Plastic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 25.1(Max) |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 3.5 |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | MS-001AD |
| Logic Family | HC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Inputs per Chip | 8 |
| Number of Outputs per Chip | 8 |
| Process Technology | CMOS |
| Polarity | Non-Inverting |
| Output Type | 3-State |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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