PackagePDIP
MountingThrough Hole
PolarityNon-Inverting
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Technical Specifications
Toshiba TC74HC245AP(P) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
20
PCB
20
Package Length (mm)
25.1(Max)
Package Width (mm)
6.4
Package Height (mm)
3.5
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Jedec
MS-001AD
Logic Family
HC
Logic Function
Bus Transceiver
Data Flow Direction
Bi-Directional
Number of Elements per Chip
1
Polarity
Non-Inverting
Process Technology
CMOS
Output Type
3-State
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC74HC245AP(P) Datasheet
Download the complete datasheet for Toshiba TC74HC245AP(P) to view detailed technical specifications.
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