Positive-edge triggered, non-inverting D-type bus interface flip-flop IC, featuring one element per chip. This CMOS logic device offers 8 inputs and 8 outputs, housed in a 20-pin plastic small outline package (SOP) with gull-wing leads for surface mounting. Operating within a temperature range of -40°C to 85°C, the component utilizes a lead-frame SMT basic package type with a 1.27mm pin pitch.
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Toshiba TC74HC273AF(IDEL) technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOP |
| Package Description | Plastic Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 13.3(Max) |
| Package Width (mm) | 5.3 |
| Package Height (mm) | 1.5 |
| Pin Pitch (mm) | 1.27 |
| Package Weight (g) | 0.22 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | HC |
| Logic Function | D-Type Bus Interface |
| Process Technology | CMOS |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 8 |
| Number of Element Outputs | 8 |
| Polarity | Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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