6-channel inverting buffer/line driver featuring 3-state CMOS logic. This integrated circuit offers 6 inputs and 6 outputs within a 16-pin PDIP through-hole package. Designed for operation across a temperature range of -40°C to 85°C, it utilizes HC logic family technology. The plastic dual in-line package measures 19.75mm (max) in length, 6.4mm in width, and 3.5mm in height, with a 2.54mm pin pitch.
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Toshiba TC74HC366AP(F) technical specifications.
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | PDIP |
| Package Description | Plastic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 19.75(Max) |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 3.5 |
| Seated Plane Height (mm) | 4.15 |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | MS-001BB |
| Logic Family | HC |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 1 |
| Number of Inputs per Chip | 6 |
| Number of Outputs per Chip | 6 |
| Process Technology | CMOS |
| Polarity | Inverting |
| Output Type | 3-State |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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