
The Toshiba TC74HCT174AFN(F,M) is a 16-element non-inverting D-type bus interface flip-flop in a small outline IC (SOL) package. It is a surface-mount device with a lead-frame SMT package type and a plastic package material. The IC has a positive-edge triggering type and a non-inverting polarity. It operates over a temperature range of -40°C to 85°C. The device is part of the HCT logic family and is based on CMOS process technology.
Toshiba TC74HCT174AFN(F,M) technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOL |
| Package Description | Small Outline IC (L Lead) |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 9.9 |
| Package Width (mm) | 3.9 |
| Package Height (mm) | 1.38 |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | HCT |
| Logic Function | D-Type Bus Interface |
| Process Technology | CMOS |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 6 |
| Number of Element Outputs | 6 |
| Polarity | Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Toshiba TC74HCT174AFN(F,M) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.