6-element CMOS inverter IC featuring a 14-pin PDIP through-hole package. This logic gate utilizes high-speed CMOS technology, offering a maximum high-level output current of -5.2 mA and a maximum low-level output current of 5.2 mA. Operating across a temperature range of -40 °C to 85 °C, the plastic dual in-line package measures 19.75mm (max) in length and 6.4mm in width, with a 2.54mm pin pitch.
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Toshiba TC74HCU04AP(M) technical specifications.
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | PDIP |
| Package Description | Plastic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 19.75(Max) |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 3.5 |
| Seated Plane Height (mm) | 4.15 |
| Pin Pitch (mm) | 2.54 |
| Package Weight (g) | 0.96 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | MS-001AA |
| Logic Family | HC |
| Logic Function | Inverter |
| Process Technology | CMOS |
| Number of Elements per Chip | 6 |
| Maximum High Level Output Current | -5.2mA |
| Maximum Low Level Output Current | 5.2mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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