Positive-edge triggered D-type bus interface flip-flop, featuring a single element with 6 inputs and 6 non-inverting outputs. This CMOS logic IC is housed in a 16-pin TSSOP (Thin Shrink Small Outline Package) with gull-wing leads for surface mounting. The package measures 5.4mm (max) in length, 4.4mm in width, and 1mm in height, with a 0.65mm pin pitch. Operating across a temperature range of -40°C to 85°C, it utilizes lead-frame SMT technology.
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Toshiba TC74LVX174FT(TB,EL technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 5.4(Max) |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | LVX |
| Logic Function | D-Type Bus Interface |
| Process Technology | CMOS |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 6 |
| Number of Element Outputs | 6 |
| Polarity | Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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