20-channel non-inverting 3-state CMOS buffer/line driver. Features 20 inputs and 20 outputs per chip, operating with a 3.6V tolerant I/O. Housed in a 56-pin Thin Shrink Small Outline Package (TSSOP) with gull-wing leads for surface mounting. This plastic package measures 14mm x 6.1mm x 1mm and is compliant with Jedec MO-153EE. Suitable for operation between -40°C and 85°C.
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| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 56 |
| PCB | 56 |
| Package Length (mm) | 14 |
| Package Width (mm) | 6.1 |
| Package Height (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153EE |
| Logic Family | VCX |
| Logic Function | Buffer/Line Driver |
| Number of Elements per Chip | 2 |
| Number of Inputs per Chip | 20 |
| Number of Outputs per Chip | 20 |
| Process Technology | CMOS |
| Polarity | Non-Inverting |
| Output Type | 3-State |
| Tolerant I/Os | 3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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