PackageTSSOP
MountingSurface Mount
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Technical Specifications
Toshiba TC74VHC123AFT(SOE) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
5.4(Max)
Package Width (mm)
4.4
Package Height (mm)
1
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Logic Family
VHC
Logic Function
Monostable Multivibrator
Process Technology
CMOS
Number of Elements per Chip
2
Maximum High Level Output Current
-8mA
Maximum Low Level Output Current
8mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC74VHC123AFT(SOE) Datasheet
Download the complete datasheet for Toshiba TC74VHC123AFT(SOE) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.