Positive-edge triggered, D-type bus interface flip-flop IC featuring a single element with four inputs and four outputs. This CMOS logic component operates within a -40°C to 85°C temperature range and is housed in a 16-pin, gull-wing lead, Small Outline IC (SOL) package designed for surface mounting. The lead-frame SMT package has a pin pitch of 1.27mm, with dimensions of 9.9mm length, 3.9mm width, and 1.38mm height.
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Toshiba TC74VHC175FN(M) technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOL |
| Package Description | Small Outline IC (L Lead) |
| Lead Shape | Gull-wing |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 9.9 |
| Package Width (mm) | 3.9 |
| Package Height (mm) | 1.38 |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Logic Family | VHC |
| Logic Function | D-Type Bus Interface |
| Process Technology | CMOS |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 4 |
| Number of Element Outputs | 4 |
| Polarity | Inverting/Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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