PackageSOL
MountingSurface Mount
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Technical Specifications
Toshiba TC74VHC221AFN(ELPM technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOL
Package Description
Small Outline IC (L Lead)
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
9.9
Package Width (mm)
3.9
Package Height (mm)
1.38
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Logic Family
VHC
Logic Function
Monostable Multivibrator
Process Technology
CMOS
Number of Elements per Chip
2
Maximum High Level Output Current
-8mA
Maximum Low Level Output Current
8mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC74VHC221AFN(ELPM Datasheet
Download the complete datasheet for Toshiba TC74VHC221AFN(ELPM to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.