Dual D-type positive-edge triggered flip-flop IC, featuring CMOS process technology and VHCT logic family. This 14-pin TSSOP package, a Thin Shrink Small Outline Package, utilizes gull-wing lead-frame SMT mounting. Designed for surface mount applications, it operates within a temperature range of -40°C to 85°C.
Sign in to ask questions about the Toshiba TC74VHCT74AFT(SOE) datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Toshiba TC74VHCT74AFT(SOE) technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 5.4(Max) |
| Package Width (mm) | 4.4 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.2(Max) |
| Package Weight (g) | 0.06 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AB-1 |
| Logic Family | VHCT |
| Logic Function | D-Type |
| Process Technology | CMOS |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 1 |
| Number of Element Outputs | 1 |
| Polarity | Inverting/Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Toshiba TC74VHCT74AFT(SOE) to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
