CMOS OR Gate IC, featuring two independent 2-input OR gate elements. This surface-mount component utilizes a Shrink Small Outline Package (SOP) with gull-wing leads, measuring 2mm x 2.3mm x 0.7mm, and a 0.5mm pin pitch. Operating within a temperature range of -40°C to 85°C, it is designed for lead-frame SMT assembly.
PackageUS
MountingSurface Mount
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Technical Specifications
Toshiba TC7W32FK(T5L,PP) technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
US
Package Description
Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
2
Package Width (mm)
2.3
Package Height (mm)
0.7
Seated Plane Height (mm)
0.75
Pin Pitch (mm)
0.5
Package Weight (g)
0.01
Package Material
Plastic
Mounting
Surface Mount
Jedec
SC-65
Logic Family
HC
Logic Function
OR
Process Technology
CMOS
Number of Elements per Chip
2
Number of Element Inputs
2-IN
Number of Element Outputs
1
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
S0562
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Toshiba TC7W32FK(T5L,PP) Datasheet
Download the complete datasheet for Toshiba TC7W32FK(T5L,PP) to view detailed technical specifications.
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