D-Type Flip-Flop, positive-edge triggered, single element IC. Features LCX logic family and CMOS process technology. Housed in an 8-pin Shrink Small Outline Package (SOP) with gull-wing leads for surface mounting. Package dimensions are 2mm x 2.3mm x 0.7mm with a 0.5mm pin pitch. Operates within a temperature range of -40°C to 85°C.
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Toshiba TC7WZ74FK(BRA) technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | US |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 2 |
| Package Width (mm) | 2.3 |
| Package Height (mm) | 0.7 |
| Seated Plane Height (mm) | 0.75 |
| Pin Pitch (mm) | 0.5 |
| Package Weight (g) | 0.01 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | SC-65 |
| Logic Family | LCX |
| Logic Function | D-Type |
| Process Technology | CMOS |
| Number of Elements per Chip | 1 |
| Number of Element Inputs | 1 |
| Number of Element Outputs | 1 |
| Polarity | Inverting/Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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