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Toshiba TD62703FG(5) technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOP |
| Package Description | Plastic Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 10.3 |
| Package Width (mm) | 5.3 |
| Package Height (mm) | 1.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Type | NPN|PNP |
| Configuration | Hex |
| Number of Elements per Chip | 6 |
| Maximum Continuous DC Collector Current | 0.05A |
| Maximum Power Dissipation | 625mW |
| Maximum Collector-Emitter Saturation Voltage | 2.5@1mA@40mAV |
| Minimum DC Current Gain | 100@40mA@5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | S0562 |
| EU RoHS | Yes |
| Schedule B | 8541210080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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