Quick Jump:
Chat with Datasheet
Sponsored by
Sign in to ask questions about the Toshiba TD62782APG(5,J,ND) datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Technical Specifications
Toshiba TD62782APG(5,J,ND) technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | PDIP |
| Package Description | Plastic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 18 |
| PCB | 18 |
| Package Length (mm) | 24.6 |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 3.5 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | MS-001AC |
| Type | NPN|PNP |
| Configuration | Octal |
| Number of Elements per Chip | 8 |
| Maximum Continuous DC Collector Current | 0.05A |
| Maximum Power Dissipation | 1470mW |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | S0562 |
| Schedule B | 8541290080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Datasheet
Toshiba TD62782APG(5,J,ND) Datasheet
Download the complete datasheet for Toshiba TD62782APG(5,J,ND) to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.