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Toshiba TMP82C55AP-2(Z) technical specifications.
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | DIP |
| Package Description | Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 40 |
| PCB | 40 |
| Package Length (mm) | 51.2(Max) |
| Package Width (mm) | 13.4 |
| Package Height (mm) | 3.5 |
| Seated Plane Height (mm) | 4.5 |
| Mounting | Through Hole |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Category | CMOS Programmable Peripheral Interface |
| Cage Code | S0562 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
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