PackageDIP
MountingThrough Hole
Quick Jump:
Technical Specifications
Toshiba TMP82C55AP-2(Z) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
DIP
Package Description
Dual In Line Package
Lead Shape
Through Hole
Pin Count
40
PCB
40
Package Length (mm)
51.2(Max)
Package Width (mm)
13.4
Package Height (mm)
3.5
Seated Plane Height (mm)
4.5
Mounting
Through Hole
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Category
CMOS Programmable Peripheral Interface
Compliance
Cage Code
S0562
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TMP82C55AP-2(Z) Datasheet
Download the complete datasheet for Toshiba TMP82C55AP-2(Z) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.