PackageDBSMPF
MountingThrough Hole
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Technical Specifications
Trident Microsystems TDA6111Q/N4,112 technical specifications.
General
| Package Family Name | DBSMPF |
| Package/Case | DBSMPF |
| Pin Count | 9 |
| PCB | 9 |
| Tab | Tab |
| Package Length (mm) | 21.8(Max) |
| Package Width (mm) | 3.7(Max) |
| Package Height (mm) | 6.48(Max) |
| Mounting | Through Hole |
| Number of Circuits | 1 |
| Typical Gain Bandwidth Product | 1600MHz |
| Maximum Power Dissipation | 4000mW |
Compliance
| Cage Code | 5ZQR0 |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Trident Microsystems TDA6111Q/N4,112 Datasheet
Download the complete datasheet for Trident Microsystems TDA6111Q/N4,112 to view detailed technical specifications.
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